| 摘要 |
<p>PURPOSE:To prevent moisture from penetrating into a device by a method wherein the tips of leads are bonded to the side face of a semiconductor element with insulating material. CONSTITUTION:A semiconductor element 11 is positioned corresponding to the positions of leads 12, insulating material 13 is applied between the tips of the leads 12 and the side face of the semiconductor element 11 and tentatively set to fix the leads 12 and semiconductor element 11. A terminal led out onto the semiconductor element 11 is connected to a corresponding lead 12 with a fine metal wire 14, and a resin mold 15 is provided to cover all the semicon ductor element 11, the fine metal wire 14, and a connection part where the leads 12 and the metal fine wire 14 are connected together. By this setup, mois ture is prevented from penetrating into a device.</p> |
