| 摘要 |
PROBLEM TO BE SOLVED: To prevent an electronic component in an electronic apparatus from being exposed to high temperatures, by providing a heat dissipation structure, which is capable of increasing thermal radiation (emission), in the electronic apparatus.SOLUTION: A metal plate 104 provided to contact with an electronic apparatus 102 and having an opening 105, and an annular metal structure 106 at a periphery of the opening are arranged such that electromagnetic fields at a frequency around a peak according to the Planck's law enhance each other. Accordingly, thermal radiation (emission) 107 can be increased, so that heat inside the electronic apparatus 102 can be favorably diffused to the outside (atmosphere).SELECTED DRAWING: Figure 1 |
