| 摘要 |
PURPOSE:To avoid the generation of a level-difference caused by direct printing of an insulating layer on a pattern, and obtain a highly reliable multilayer wiring board of high density, by burying an insulating layer in the gap between conductor patterns. CONSTITUTION:On a ceramic board 1, conductor paste is printed to be about 10-20mum thick and baked, thereby forming a first metal layer 2. In the part except the layer 2 and the vicinity thereof, e.g. the gap of the layer 2, insulating paste is printed to be about 10-20mum thick and baked, thereby forming a first insulating layer 3. After that, insulating paste is buried in the gap 12 between the layers 2, 3, and baked. On the region except a viahole 5 forming part, insulating paste is printed and baked, thereby forming a second insulating layer 6. Conductor paste is buried in the viahole 5 and baked. Next a second metal layer 7 is printed and baked, thereby constituting a two-layer structure wiring board. By this constitution, a level-difference is not generated when the number of layers is increased, and high density and reliability can be realized. |
