发明名称 FORMATION OF VIA IN CERAMIC CIRCUIT BOARD
摘要 PURPOSE:To suppress the expansion of a gas body and obtain a highly reliable via by performing metal infiltrating works in a pressurized atmosphere. CONSTITUTION:A via is formed by making a molten metallic material 5 to flow into a through hole 3 after a plated layer 4 is formed on the inner surface of the holes bored through a multilayered ceramic substrate 2 formed by piling up and sintering green sheets 1 or a single-layer ceramic substrate formed by sintering a green sheet. When the via is formed, the infiltration of the metallic material 5 into the hole 3 is performed in the atmosphere of a high-pressure inert gas. Therefore, the expansion, etc., of the plated layer 4 associated with the metal infiltrating work can be suppressed and a via having a stable quality can be obtained.
申请公布号 JPH03178196(A) 申请公布日期 1991.08.02
申请号 JP19890316516 申请日期 1989.12.07
申请人 FUJITSU SHINTAA KK 发明人 SUZUKI HIRONOBU;KUWAOKA MASAO;EJIRI WATARU;YOSHIZAWA TAKASHI;SAKAI TAKEAKI
分类号 H05K3/40;H05K3/46 主分类号 H05K3/40
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