发明名称 |
HIGH DENSITY PACKAGE INTERCONNECTS |
摘要 |
Electronic assemblies and methods including the formation of interconnect structures are described. In one embodiment an apparatus includes semiconductor die and a first metal bump on the die, the first metal bump including a surface having a first part and a second part. The apparatus also includes a solder resistant coating covering the first part of the surface and leaving the second part of the surface uncovered. Other embodiments are described and claimed. |
申请公布号 |
US2016284635(A1) |
申请公布日期 |
2016.09.29 |
申请号 |
US201615174921 |
申请日期 |
2016.06.06 |
申请人 |
INTEL CORPORATION |
发明人 |
GANESAN Sanka;QIAN Zhiguo;SANKMAN Robert L.;SRINIVASAN Krishna;ZHU Zhaohui |
分类号 |
H01L23/498;H01L23/00;H01L23/50 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
Santa Clara CA US |