| 摘要 |
<p>PURPOSE:To improve a production efficiency by a method wherein an IC module is inserted into a mounting hole of a card body, and a sealant is injected into the mounting hole to seal the IC module as well as fix it to the card body. CONSTITUTION:An IC module 13 is prepared, and this IC module 13 is inserted into a mounting hole 12 of a card body 11. Thereafter, a sealant 17, such as an epoxy resin, flows into the mounting hole from above the IC module 13 to seal the IC module 13 as well as fix the IC module 13 to the card body 11 by its adhesion. Because the IC module 13 is simultaneously sealed and fixed in the same process in this manner, the number of processes is reduced to the halves, and a production efficiency can be improved.</p> |
