| 摘要 |
COMPOSITION AND METHOD FOR IMPROVING ADHESION OF COATINGS TO COPPER SURFACES A composition for cleaning and improving the adhesion characteristics of a copper surface (which is in turn adhered to an underlying substrate) so as to enable a coating, e.g., of photoresist, to be adhered easily and completely to the copper surface, the cleaning and adhesion promoting composition consisting essentially of an aqueous solution of an alkane sulfonic acid, a surfactant and an oxidizing agent of a type, and present in an amount, sufficient to provide controlled conversion of the copper surface to a substantially clean, microroughened surface, without removing the copper surface from the underlying substrate, so that the adhesion characteristics of the copper surface are substantially increased for receiving and securely adhering a subsequently applied coating.
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