CHEMICALLY ENLARGED PHOTORESIST

摘要

PURPOSE: To chemically increase sensitivity by irradiation with UV, electron beams or X-rays by using a specified polymerizable or molecular compsn. and a specified precursor of sulfonic acid. CONSTITUTION: This photoresist contains a polymerizable or molecular compsn. whose solubility depends on the presence of a protective group capable of removal with an acid and a precursor of sulfonic acid generating the strong acid when exposed with radiation, that is, an N-fluoroalkylsulfonyloxyimide sensitizer and a polymerizable resin or a molecular monomer having a protective group such as a carbonate or carboxylate group capable of removal with the acid. When the sulfonyloxyimide sensitizer is used in various photoresist compsns, the sensitivities are increased and exposure is carried out under various radiation conditions. Chemical amplification is attained.