| 发明名称 |
MICROELECTRONIC SUBSTRATE ELECTRO PROCESSING SYSTEM |
| 摘要 |
In a processing system for electroplating semiconductor wafers and similar substrates, the contact ring of the electroplating processor is removed from the rotor of the processor and replaced with a previously deplated contact ring. This allows the contact ring to be deplated in ring service module of the system, while the processor continues to operate. Wafer throughput is improved. The contact ring may be attached to a chuck for moving the contact ring between the processors and the ring service module, with the chuck quickly attachable and releasable to the rotor. |
| 申请公布号 |
US2016298255(A1) |
申请公布日期 |
2016.10.13 |
| 申请号 |
US201615190370 |
申请日期 |
2016.06.23 |
| 申请人 |
APPLIED Materials, Inc. |
发明人 |
Moore Robert B.;Silvetti David;Wirth Paul;Harris Randy |
| 分类号 |
C25D17/06;H01L21/768;H01L21/687;C25D17/00;C25D7/12 |
主分类号 |
C25D17/06 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for processing a wafer, comprising:
clamping a first wafer between a first chuck and a first contact ring; attaching the first chuck to a rotor of a processor; processing the wafer by contacting the first wafer with an electrolyte while passing electrical current through the electrolyte; removing the first chuck from the rotor; unclamping and removing the first wafer from the first chuck; and deplating the first contact ring. |
| 地址 |
Santa Clara CA US |
