MONTAGE VON AKUSTISCHEN OBERFLAECHENWELLENEINRICHTUNGEN.

摘要

A SAW device is formed by applying metallized areas (11) to a surface of a SAW substrate (10) and attaching conductive leads (18) to the metallized areas. The substrate is inverted and located on a hybrid circuit so that the leads (18) contact and are supported on conductive areas (30) of the circuit. This mounting arrangement minimizes the stresses which occur in the substrate in its operational life. A novel shape for the device is also disclosed.