ELEKTRISCHES BAUELEMENT IN CHIP-BAUWEISE UND VERFAHREN ZU SEINER HERSTELLUNG.

摘要

The components, when completed, have a coating (1) of insulating material, and electrical connections (9) which are connected via holes (8) to internal metal contacts (7) and finally with the component (4). The coating consists of a plastic housing (2) in which there is an internal space (3) in which the component is placed and surrounded with potting resin (5) and at least one plastic foil closes the space on the outside. The plastic components used are all resistant to the temps. used in applications, especially to wave-soldering temps. The foils (6) and potting resin (5) are provided with holes (8) which are deep enough (10) to reach the electrical contacts (7). Outer metallic contacts (9) consist of metal layers (11) which follow the contours of the outer foils (6) as well as those of the walls (12) of the openings (8) and continue through a right angle onto the adjacent outer surface (13) of the casing (2) where they are separated by an insulation gap (14). The case (1) is made pref. of epxoy-, polyphenylenesulphide- (PPS), or polyimide (PI) resin. The potting resin is pref. epoxy-resin. The plastic foils (6) consist of epoxy-, filled phenolic-, PPs- or PI-resin and are pref. 0.1-1mm thick. The openings (8) are made pref. by drilling, milling or laser action and pref. 0.1-2mm in dia. The internal electrical connections (7) are pref. Al or Zn and have Cu as the upper layer. A mfg. process is also claimed.