| 发明名称 |
Production of a semiconductor device using implantation into a thermohardening resin. |
| 摘要 |
<p>A particle beam implantation into a thermohardening resin has an effect in hardening the thermohardening resin of the implanted region sufficiently, and the non-implanted part is not hardened. Therefore, the non-hardened resin of the non-implanted part can be removed at high selectivity with the hardened resin of the implanted part and an inverted pattern comprising hardened resin is produced. <IMAGE></p> |
| 申请公布号 |
EP0476801(A2) |
申请公布日期 |
1992.03.25 |
| 申请号 |
EP19910302340 |
申请日期 |
1991.03.19 |
| 申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
OKU, TOMOKI |
| 分类号 |
H01L21/302;H01L21/027;H01L21/265;H01L21/266;H01L21/285;H01L21/3065;H01L21/3105;H01L21/335;H01L21/338;H01L29/812 |
主分类号 |
H01L21/302 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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