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发明名称
PROCESS FOR IMPROVING THE ADHESION OF ELECTROLESSLY PLATED METAL LAYERS TO POLYIMIDE SURFACES
摘要
申请公布号
EP0322641(B1)
申请公布日期
1992.05.20
申请号
EP19880120876
申请日期
1988.12.14
申请人
BAYER AG
发明人
GIESECKE, HENNING, DR.;WOLF, GERHARD DIETER, DR.;ZECHER, WILFRIED, DR.
分类号
C08L79/08;C08J7/12;C23C18/30;C23C18/40;H05K1/03;H05K3/18;H05K3/38
主分类号
C08L79/08
代理机构
代理人
主权项
地址
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