Methods and apparatus for cleaning semiconductor wafers

摘要

A method for cleaning semiconductor substrate using ultra/mega sonic device comprising holding a semiconductor substrate by using a chuck, positioning a ultra/mega sonic device adjacent to the semiconductor substrate, injecting chemical liquid on the semiconductor substrate and gap between the semiconductor substrate and the ultra/mega sonic device, changing gap between the semiconductor substrate and the ultra/mega sonic device for each rotation of the chuck during the cleaning process by turn the semiconductor substrate or the ultra/mega sonic device clockwise or counter clockwise.

主权项

1. An apparatus for cleaning semiconductor substrate using ultra/mega sonic device, comprising:
a chuck holding a semiconductor substrate; a ultra/mega sonic device being positioned adjacent to the semiconductor substrate; at least one nozzle injecting chemical liquid on the semiconductor substrate and into a gap between the semiconductor substrate and the ultra/mega sonic device; a control unit and a driving mechanism changing the gap between the semiconductor substrate and the ultra/mega sonic device by changing the angle between the semiconductor substrate and the ultra/mega sonic device, wherein the gap between the semiconductor substrate and the ultra or mega sonic device changes for each rotation of the semiconductor substrate; wherein the angle is changed by turning ultra/mega sonic device clockwise and/or counter clockwise around an axis parallel to the semiconductor substrate, or the angle is changed by turning the semiconductor substrate clockwise and/or counter clockwise around an axis parallel to the surface of the ultra/mega sonic device.