Light emitting element manufacturing method

摘要

A light emitting element manufacturing method includes a wafer preparing process of preparing the semiconductor wafer, and a wafer dividing process of dividing the semiconductor wafer. In the wafer dividing process, in a vertical dividing region, a line position shifted by a predetermined distance from a center line of the vertical dividing region in a width direction to one side in the width direction is taken as the cutting start point to divide the semiconductor wafer.

主权项

1. A light emitting element manufacturing method of dividing a semiconductor wafer, the method comprising:
a wafer preparing process of preparing the semiconductor wafer, wherein the semiconductor wafer has a plurality of rectangular light emitting element segments arranged and disposed in vertical and horizontal directions by laminating a GaN-based semiconductor on a sapphire substrate having a C-plane as a principal surface, has a horizontal dividing region to be divided along a direction parallel to an A-plane of the sapphire substrate with a narrower width than a vertical dividing region to be divided along a direction perpendicular to the A-plane, and has an N-electrode of the light emitting element segment disposed on at least a first side of both sides of the vertical dividing region to obtain light emitting elements with a cutting start point being provided at a −C-plane side of the sapphire substrate, wherein the light emitting element segment comprises a shorter side and a longer side, and the shorter side of the light emitting element segment is formed so as to be parallel to the vertical dividing region; and a wafer dividing process of dividing the prepared semiconductor wafer, wherein in the wafer dividing process, in the vertical dividing region, a line position shifted by a predetermined distance from a center line of the vertical dividing region in a width direction to one side in the width direction toward the first side is taken as the cutting start point to divide the semiconductor wafer.