SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

摘要

PURPOSE:To prevent the generation of cracks in a resin seal type LSI package of LOC(lead on chip) structure having a bus bar lead. CONSTITUTION:Plated patterns 9 composed of Ag or Au or Pd are formed in regions (bonding areas) on the upper surfaces of inner leads 6A and a bus bar lead 7 with which regions one-ends of bonding wires 8 are connected. The bus lead 7 is arranged inside the outer periphery of an insulating tape 4.