| 摘要 |
PROBLEM TO BE SOLVED: To provide a packaging technique enabling more suitable secondary mounting.SOLUTION: An electronic component package according to the embodiment of the present disclosure, comprises: a metal pattern layer having a first principal surface and a second principal surface opposite to the first principal surface; an electronic component provided onto the first principal surface and electrically connected to the metal pattern layer; at least one metal member provided onto the first principal surface and electrically connected to the metal pattern layer; a sealing resin layer provided onto the first principal surface, the electronic component, and the at least one metal member; and an insulation layer provided onto the second principal surface. A thickness of the at least one metal member is larger than that of the electronic component. In a plane view, the at least one metal member is provided only at a position contacted with an end of the first principal surface. At least one part of the metal pattern layer positioned at a lower region of the at least one metal member is exposed from the insulation layer.SELECTED DRAWING: Figure 7 |
