PACKAGE FOR A SEMICONDUCTOR DEVICE AND METHOD THEREFOR

摘要

A semiconductor device comprising a semiconductor unit with leads extending therefrom is placed on a bottom packaging tray having a die-shaped upper surface. A top lubricating type film is used over the device 10 and below a punch unit that is used to bend the leads. A process of assembling the semiconductor device on a die type package is disclosed which includes placing the semiconductor device with leads on a packaging tray with upper lead-shaped baring surfaces, placing an anti-friction film sheet over the tray and over the device with its leads extending therefrom, and actuating a punch unit disposed above the film sheet, thereby forming or bending the leads and simultaneously using the die type tray for packaging the semiconductor device.