COVER PLATE FOR SEMICONDUCTOR DEVICES

摘要

A metal cover plate (10) for covering a semiconductor chip mounted on a package base plate comprises an upper central portion, a flange (11) extending outwardly from the outer edges of the central portion, and a side wall portion (12) extending perpendicularly from the flange along all sides thereof, said central portion having at least one portion in parallel with the package base plate. The central portion is formed with reinforcing portions (14,15) in the form ridges of gable roofs and valleys in cross section formed along the diagonal lines of the central portion or in the form of a ridge or rib substantially semicircular in cross section extending upwardly or downwardly along each diagonal line. Deflection of the top wall portion of the package in the pressure application process can thus be prevented.