发明名称 Connector for a plated or soldered hole.
摘要 <p>A connector for electrically connecting a plated or soldered through hole of a printed circuit board to another electrical device includes a plurality of conductors each having a deflection arm for maintaining a contact force on the circuit board and a dimple formed as a continuous surface from the deflection arm. Each dimple is sized and shaped to enter a through hole and to electrically contact the plating or solder material formed in the hole. Contact can be at a point within the hole or along the circumference of the hole. In addition, each dimple is sized and shaped to enter a range of through hole sizes. In a preferred embodiment each dimple is formed in a generally pyramidal shape with creased edges and a smooth apex. The dimple may also be formed in a generally conical shape. <IMAGE></p>
申请公布号 EP0578420(A1) 申请公布日期 1994.01.12
申请号 EP19930305056 申请日期 1993.06.28
申请人 TELEDYNE KINETICS 发明人 KURBIKOFF, PETER A.;CHITAMITARA, APICHART N.
分类号 H01R12/57;H05K3/32;H05K3/42;(IPC1-7):H01R23/72 主分类号 H01R12/57
代理机构 代理人
主权项
地址