RESIN COMPOSITION FOR THREE-DIMENSIONAL MOLDING

摘要

PROBLEM TO BE SOLVED: To provide a resin composition for three-dimensional molding from which such a three-dimensional molded object can be fabricated with good accuracy that can be matched in a coefficient of thermal expansion to that of a peripheral member when the object is used as a component in various devices.SOLUTION: The resin composition for three-dimensional molding comprises a curable resin and a glass filler, in which the glass filler has a coefficient of thermal expansion of 60×10/°C or less at -40 to 50°C, and the content of SiOin the composition is 90 mass% or less.SELECTED DRAWING: None