发明名称 |
DEVICE INTEGRATION OF ACTIVE COOLING SYSTEMS |
摘要 |
In various embodiments, component-level and product-level devices incorporated one more low-profile cooling devices for dissipating heat. The low-profile cooling devices may include multiple benders arranged on a substrate. The benders are actuated so as to cause movement thereof, thereby producing an air flow. |
申请公布号 |
WO2016185287(A2) |
申请公布日期 |
2016.11.24 |
申请号 |
WO2016IB00904 |
申请日期 |
2016.05.17 |
申请人 |
NANOAIR LTD. |
发明人 |
AXELROD, Ekaterina;FINE, Eran;OREN, Shlomo;HERMON, Ziv |
分类号 |
H01L23/367;H05K7/20 |
主分类号 |
H01L23/367 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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