发明名称 Process for growing a thin metallic film
摘要 A chemical vapor deposition process for growing a thin metallic film of copper or gold on a substrate includes providing a starting material composed of a beta -ketonato type metal complex of gold or copper in a heated container; preparing a carrier gas for the starting material which is composed of hydrogen as a reducing agent and at least one electron donating substance which bonds to and forms a molecular compound with the starting material by donating an electron to the starting material; passing a flow of the carrier gas through the heated container containing the starting material to form the molecular compound in situ and provide a flow of a gas mixture; introducing the flow of the gas mixture into a reaction chamber in which a substrate is positioned; and growing gold or copper on the substrate by thermally decomposing the molecular compound and any remaining starting material under temperature conditions effective therefor.
申请公布号 US5316796(A) 申请公布日期 1994.05.31
申请号 US19910665610 申请日期 1991.03.07
申请人 NIPPON TELEGRAPH AND TELEPHONE CORPORATION 发明人 AWAYA, NOBUYOSHI;ARITA, YOSHINOBU
分类号 C23C16/18;C23C16/44;C23C16/448;C23C16/455;(IPC1-7):C23C16/04;C23C16/06 主分类号 C23C16/18
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