| 摘要 |
<p>An electronic circuit assembly comprises a multi-layer printed circuit board (10) having an internal thermally conductive plane (12), such as a ground plane. First (18) and second (24) sets of thermally conductive vias extend through the circuit board (10) and make thermal contact with the thermally conductive plane (12). An electronic component (14) is mounted on the circuit board (10) in thermal contact with the first set of thermally conductive vias (18), and a heatsink (22) is mounted on the circuit board (10) in thermal contact with the second set of thermally conductive vias (24). Thus, heat generated by the component (14) can pass through the first set of vias (18), the internal thermally conductive plane (12), and the second set of vias (24), to the heatsink (22). This provides greater flexibility in the positioning of the component (14) and heatsink (22). <IMAGE></p> |
