FILM TYPE PACKAGE AND MANUFACTURING METHOD THEREOF

摘要

The method is useful for the light and thin package by utilizing a single assembly line of devices and maximizing power dissipation. The method comprises (A) bonding a bond pad (1) on a chip (2) to an inner lead (3) in a lead frame (5); (B) feeding a thermoplastic resin film (10) to the upper and lower position of the chip; (C) encapsulating the chip with the thermoplastic film by using the squeezing die (20).