| 发明名称 |
High power semiconductor device having a housing. |
| 摘要 |
<p>A flat-pack type semiconductor device has an anode buffer plate (50) on a semiconductor element (1). The anode buffer plate consists of a central position (51) and a plurality of arms (61, 63) extending therefrom. Each of the arms has a straight portion (61a) placed on a guide ring (70) and a hooked-portion (61b) inserted in the gap (73) between the guide ring and an insulating cylinder (10).</p> |
| 申请公布号 |
EP0428044(B1) |
申请公布日期 |
1995.02.08 |
| 申请号 |
EP19900121214 |
申请日期 |
1990.11.06 |
| 申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
NIWAYAMA, KAZUHIKO, MITSUBISHI DENKI K.K. |
| 分类号 |
H01L29/744;H01L23/051;H01L29/74;(IPC1-7):H01L23/051 |
主分类号 |
H01L29/744 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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