Semiconductor device and method for manufacturing the same

摘要

A semiconductor device includes first, second, and third molded bodies. The first molded body covers a first light emitting element, a part of a lead electrically connected to the first light emitting element, a first light receiving element configured to detect a light emitted from the first light emitting element, and a part of a lead electrically connected to the first light receiving element with a first resin. The second molded body covers a second light emitting element, a part of a lead electrically connected to the second light emitting element, a second light receiving element configured to detect a light emitted from the second light emitting element, and a part of a lead electrically connected to the second light receiving element with the first resin. The third molded body molds the first and the second molded bodies as one body using a second resin.

主权项

1. A semiconductor device comprising:
a first molded body comprised of a first resin and covering a first light emitting element, a part of a first primary lead electrically connected to the first light emitting element, a first light receiving element, and a part of a secondary lead electrically connected to the first light receiving element; a second molded body comprised of the first resin and covering a second light emitting element, a part of a second primary lead electrically connected to the second light emitting element, a second light receiving element, and a part of the secondary lead electrically connected to the second light receiving element; and a third molded body having a light-shielding portion between the first molded body and the second molded body, the third molded body covering the first molded body and the second molded body, and the first molded body having a first lateral surface on the light-shielding portion, wherein the secondary lead has a connecting portion between the first molded body and the second molded body, the connecting portion being covered by a portion of first resin between the first molded body and the second molded body, and the first molded body has a protruding portion of first resin protruding from the first lateral surface into the light-shielding portion, the protruding portion spaced from the connecting portion along the first lateral surface.