| 摘要 |
The present invention pertains to a composite structure comprised of a matrix material, such as metal, and a plurality of diamond particles dispersed within and surrounded by the matrix material. In a first embodiment, the composite structure is used as an electronic package to house an electrical device such as an integrated chip. The diamond particles are dispersed within the matrix material in proportion such that the coefficient of thermal expansion of the package essentially matches that of the electronic devices. In another embodiment, the composite structure can be used as a thermal conductor, such as a heat sink. In yet another embodiment, the composite structure can be used as a component subject to attrition. The diamonds offer unexcelled wear resistance and transfer the heat efficiently. The invention is also a method of producing a diamond composite structure including comprising the steps of casting diamond particles, binding particle and flow medium into a mold. Then, there is the step of heating the mixture such that flow medium is essentially removed and the binding particles hold the diamond particles into a preform. Next, there is the step of infiltrating the preform with molten matrix material. Alternatively, loose diamond particles may be infiltrated directly with the matrix material. In an alternative embodiment, the method for producing a composite structure includes the step of casting a mixture of diamond particles and matrix material in a mold.
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