| 摘要 |
An assemblage (10) for relieving overpressure in an enclosure (12) has a first panel (14) configured to surround an opening (13) in the enclosure (12), The first panel (14) comprises an outer skin (19) and a thermal barrier layer (15) for providing insulation during normal operation, A gasket member (24) is bonded to the thermal barrier layer (15) between panel edges (22). The gasket member (24) includes a magnetic portion (26) comprising magnets (23) encased in outer layer (16) for releaseably sealing the first panel (14) to the enclosure (12) and a bellows portion (28) for accommodating movements in the first panel (14) during thermal expansion.
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