Joined ceramic-metal composite.

摘要

A joined ceramic-metal composite having a copper sheet (2) directly joined to a ceramic substrate (1) is disclosed. This composite is characterized by having a plurality of parallel grooves (3) formed on the surface of the copper sheet (2) to be joined to the ceramic substrate (1). The products of this invention show substantially none of the defects such as blisters inflicated on the copper sheet (2) during the course of union by heating and, therefore, serve advantageously as ceramic circuit substrates for use in transistor modules, for example.