SEMICONDUCTOR PACKAGE

摘要

The semiconductor package comprises a body for receiving a semiconductor chip(6), a tray having a tray wing part(4a) externally expanded the one side of the tray to the direction of the pad of the chip, an electroconductive line formed the electroconductive region to the direction of the expansion of the tray wing part in the same line of the pad, a first cap of the semiconductor containing lead part having protuberances for the electrical connection of the pad and the electroconductive line side part, a second cap of the package of an insulating protective layer coated with an insulating coating material, and an outer lead.