具有大致呈L型焊锡部之接地板之上–下调谐器,申请号TW084107197-传众专利搜索

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发明名称	具有大致呈L型焊锡部之接地板之上–下调谐器
摘要
申请公布号	TW274657	申请公布日期	1996.04.21
申请号	TW084107197	申请日期	1995.07.12
申请人	夏普股份有限公司	发明人	深井诚一郎
分类号	H03J3/02	主分类号	H03J3/02
代理机构		代理人	洪武雄台北巿城中区武昌街一段六十四号八楼;陈灿晖台北巿城中区武昌街一段六十四号八楼
主权项
地址	日本

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