发明名称 RADIATING PLATE AND COOLING METHOD USING SAME
摘要 <p>A heat radiating board and a method for cooling by utilizing the same based on a novel principle of heat gradient. And, this heat radiating board, which is used by being disposed between a high temperature zone and a low temperature zone, consists of a metal plate and a heat gradient-forming layer laminated on the surface thereof facing the low temperature zone, this heat gradient-forming layer being formed from a heat conductive material having a heat volume and an absorption of heat of radiation smaller than the metal plate. <IMAGE></p>
申请公布号 EP0716444(A1) 申请公布日期 1996.06.12
申请号 EP19940925625 申请日期 1994.09.02
申请人 KABUSHIKI KAISHA SEKUTO KAGAKU 发明人 KUJIRAI, YUMIKO;KUJIRAI, MASAMI;KUJIRAI, YUKIO
分类号 F28F3/00;F16L59/08;F28F13/18;F28F21/00;H01L23/373;(IPC1-7):H01L23/36 主分类号 F28F3/00
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