Film carrier tape for semiconductor devices

摘要

In a base film there are formed a device hole and outer lead bonding (OLB) holes with specified sizes opened in parallel to the respective edge parts of the device hole. By the formation of the OLB holes there are formed suspender in the regions placed between the OLB holes and the device hole. A group of leads each having an inner lead bonding (ILB) lead part and an OLB lead part of specified width are bonded to each suspender. A reinforcement pattern extending on the suspender toward a corner part of suspender and bonded to the suspender is formed for the lead arranged the closest to the corner part of suspender from among the leads of the lead group. <IMAGE>