发明名称 Copper@ electrodeposition from etching liquid
摘要 Copper deposition from an etching liquid involves passing the liquid through a buffer vessel before entry into a multi-cell electrolysis tank to provide uniform distribution to the individual cells of the tank. A sensor (34), for adjusting the etching liquid, is located in a by-pass (36) to an etching liquid circulation line (37) between an etching vessel (32) and the electrolysis cell (33) and is connected to the circulation line (37) in adjustable time intervals by a valve (38), a switching phase of the sensor (34) occurring when the valve (38) is closed, i.e. the etching liquid is stationary. Also claimed is an apparatus for carrying out the above process.
申请公布号 CH686728(A5) 申请公布日期 1996.06.14
申请号 CH19930002029 申请日期 1993.07.06
申请人 DR. H.C. DIPL.-ING. WALTER HOLZER 发明人 HOLZER, WALTER, DIPL.-ING.
分类号 C23F1/46;C25C7/00;(IPC1-7):C25C7/00 主分类号 C23F1/46
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