| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition superior in reliability and allowing for forming of a cured product exhibiting a small degree of thermal decomposition (weight reduction) even when left under a high temperature of 200 to 250°C for a long period of time and superior mechanical properties even under a high-temperature and high-humidity environment.SOLUTION: The liquid resin composition is provided which is composed of (A) a cyanate ester compound having 2 or more cyanato groups in one molecule, (B) a phenol curing agent containing a resorcinol-type phenol resin, (C) an epoxy resin and (D) a curing accelerator, in which mass of (A) the cyanate ester compound is 30 to 80 pts.mass with respect to 100 pts.mass of a sum total of the (A) the cyanate ester compound, (B) the phenol curing agent and (C) the epoxy resin.SELECTED DRAWING: None |
