| 摘要 |
An exposure apparatus includes a cleaning tool which is located at a position where it is brought into contact with the entire surface of a wafer holder when a wafer stage moves within a predetermined driving range, and a vertical driving shaft for biasing the cleaning tool against the wafer holder. While the cleaning tool is biased against the wafer holder, the wafer stage is moved within the predetermined driving range, thereby cleaning the wafer holder.
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