发明名称 Apparatus for processing substrates having a film formed on a surface of the substrate
摘要 A substrate processing apparatus according to this invention includes an interface section having a first transfer member for transferring an object from a coating process section for applying a process solution to the object in accordance with a single sheet process to an object holding member, and a moving member for detachably supplying a plurality of object holding member and simultaneously moving the plurality of object holding member, and a heat-treatment section having a second transfer member for transferring the object placed on the object holding member to a heat-treatment section for heat-treating the plurality of objects, which have undergone the coating process, in accordance with a batch process.
申请公布号 US5565034(A) 申请公布日期 1996.10.15
申请号 US19940331083 申请日期 1994.10.28
申请人 TOKYO ELECTRON LIMITED;TOKYO ELECTRON KYUSHU LIMITED 发明人 NANBU, MITSUHIRO;IIDA, NARUAKI;GOTOU, HIDEAKI;TATEYAMA, MASANORI;YOSHIMOTO, YUJI;ISHIMOTO, TOMOKO;YAEGASHI, HIDETAMI;KAWAKAMI, YASUNORI;FUKUDA, TAKAHIDE;FUJIMOTO, AKIHIRO;TAKEKUMA, TAKASHI;MATSUKAWA, HIROYUKI
分类号 H01L21/00;H01L21/677;(IPC1-7):B05C5/00 主分类号 H01L21/00
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