METHOD OF ELECTROPLATING A SUBSTRATE, AND PRODUCTS MADE THEREBY

摘要

Disclosed is an electroplating method and products made therefrom, which in one embodiment includes using a current density J0, to form a conductive metal layer (30) having a surface roughness no greater than the surface roughness (20) of the underlying member (10). In another embodiment of electroplating a substrate surface having peaks and valleys, the method includes electroplating a conductive metal onto the peaks to cover the peaks with the conductive metal, and into the valleys to substantially fill the valleys with the conductive metal.