发明名称 CHEMICAL MECHANICAL POLISHING PAD WITH WINDOW
摘要 PROBLEM TO BE SOLVED: To provide a chemical mechanical polishing pad that mitigates issues of a window bulge and uneven window wear.SOLUTION: A chemical mechanical polishing pad 10 has a polishing layer 20, an endpoint detection window 30, a subpad 25, and a stack adhesive 23. The subpad includes a plurality of apertures 42, 45, 47 in optical communication with the endpoint detection window. A polishing surface 14 of the polishing layer is adapted for polishing a substrate.SELECTED DRAWING: Figure 6
申请公布号 JP2016168670(A) 申请公布日期 2016.09.23
申请号 JP20160046719 申请日期 2016.03.10
申请人 ROHM & HAAS ELECTRONIC MATERIALS CMP HOLDINGS INC 发明人 JOSEPH SO;QIAN BAINIAN;JANET TESFAI
分类号 B24B37/11;B24B37/00;H01L21/304 主分类号 B24B37/11
代理机构 代理人
主权项
地址