Improvements in or relating to semiconductor integrated circuit devices

摘要

Fabricating a top lead fuse includes: (a) forming a conductive top lead fuse on a layer of insulator material; (b) depositing a top insulator over the top lead fuse at a top to side wall thickness ratio of at least 1:1; and (c) anisotropically etching the top insulator back universally to a top to side wall thickness ratio approx. 1:2 to 4:4.