发明名称 Method of making a semiconductor image sensor device
摘要 An image sensor (10) has a substrate (1), an active layer (3') having a source region and a drain region placed on said substrate (1), a gate insulation layer (4') placed on said active layer, and a gate electrode layer (5') on said gate insulation layer (4'). The active layer (3') is produced by the steps of producing amorphous silicon layer by using disilane gas (Si2H6) through Low Pressure CVD process, and annealing said layer at 500 DEG -650 DEG C. for 4-50 hours in nitrogen gas atmosphere. The gate insulation layer (4') is produced through oxidation of the surface of the active layer at high temperature around 900 DEG -1100 DEG C. The oxidation process at high temperature improves the anneal process and improves the active layer. Thus, an image sensor with uniform characteristics is obtained with improved producing yield rate.
申请公布号 US5576222(A) 申请公布日期 1996.11.19
申请号 US19940324737 申请日期 1994.10.18
申请人 TDK CORP.;SEMICONDUCTOR ENERGY LABORATORY CO. LTD. 发明人 ARAI, MICHIO;IKEDA, MASAAKI;SUGIURA, KAZUSHI;FURUKAWA, NOBUO;KODAMA, MITSUFUMI;YAMAUCHI, YUKIO;SAKAMOTO, NAOYA;FUKADA, TAKESHI;HIROKI, MASAAKI;TAKAYAMA, ICHIROU
分类号 H01L31/20;(IPC1-7):H01L27/14;H01L27/01;H01L21/336;H01L21/71 主分类号 H01L31/20
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