发明名称 |
PROCEDE DE REALISATION DE COMPOSANTS SEMICONDUCTEURS, NOTAMMENT SUR GAAS OU INP, AVEC RECUPERATION DU SUBSTRAT PAR VOIE CHIMIQUE. |
摘要 |
The method is characterized by the steps consisting in: a) producing a semi-insulating or n-type substrate; b) forming a separating layer of a p+-type doped material on the surface of said substrate; c) forming an active layer on said separating layer, the active layer including at least a bottom layer with n-type doping; d) making a set of semiconductor components by etching and metalizing said active layer; g) fixing a common support plate on the assembly made in this way, thereby holding the components together mechanically; and h) dissolving the material of the separating layer anodically and without illumination while leaving the other materials intact, thereby separating the substrate from said components without dissolving the substrate.
|
申请公布号 |
FR2684801(B1) |
申请公布日期 |
1997.01.24 |
申请号 |
FR19910015139 |
申请日期 |
1991.12.06 |
申请人 |
PICOGIGA SA |
发明人 |
NUYEN LINH T. |
分类号 |
H01L21/306;H01L21/20;H01L21/203;H01L21/205;H01L21/338;H01L21/68;H01L21/76;H01L21/78;H01L21/8252;H01L27/06;H01L29/80;H01L29/812;(IPC1-7):H01L21/02 |
主分类号 |
H01L21/306 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|