发明名称 Electrolytic process for producing lead sulfonate and tin sulfonate for solder plating use
摘要 An electrolytic process for producing lead and tin sulfonates which comprises applying a DC voltage to an anode and a plurality of cathodes in an electrolytic cell and thereby dissolving lead or tin in an electrolytic solution. The electrolytic cell is partitioned by cation- and anion-exchange membranes into anode and cathode chambers. The electrolytic solution is a solution of an organic sulfonic acid, and the anode is lead or tin. The process reduces contents of radioisotopes such as uranium and thorium to a level of less than 50 ppb, and therefore the coatings formed by solder plating using the lead and tin salts in accordance with the invention show radioactive alpha particle counts of less than 0.1 CPH/cm2.
申请公布号 US5618404(A) 申请公布日期 1997.04.08
申请号 US19950442535 申请日期 1995.05.16
申请人 DAIWA FINE CHEMICALS CO., LTD. 发明人 OKUHAMA, YOSHIAKI;MASAKI, SEISHI;TAKEUCHI, TAKAO;MATSUDA, YOSHIHARU;YOSHIMOTO, MASAKAZU
分类号 C25B3/00;C25D3/60;(IPC1-7):C25B1/00 主分类号 C25B3/00
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