| 摘要 |
patterning a signal electrode(2) on the bottom of a ceramic wafer(3), and joining a driving substrate(1) on the bottom of the signal electrode(2) after patterning a bias electrode(4) on top of the ceramic wafer(3); insulating the revealed surface of the bias electrode(4) and patterning a first photoresist film(20) on the surface of the insulated part, and removing the ceramic wafer(3) except the region of the first photoresist film(20); patterning a second photoresist film(21) on the center of the surface of the first photoresist film(20), and forming a mirror(22) on the surface except the region of the second photoresist film(21); and removing the first and the second photoresist film(20,21).
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