发明名称 Room temperature-curable organopolysiloxane composition
摘要 A room temperature-curable organopolysiloxane composition is disclosed, comprising (A) 100 parts by weight of an organopolysiloxane terminated with a silanol group or an alkoxy group, (B) from 0.1 to 30 parts by weight of an organosilicon compound containing more than 2, in average, of hydrolyzable groups bonded to the silicon atom per molecule, (C) from 1 to 650 parts by weight of an oil-absorbing filler which has been prepared by impregnating (a) a porous filler with (b) a volatile organic compound which is incompatible or partly compatible to component (A) and compatible with an organic oily substance in an amount of from 1% by weight based on the weight of the porous filler up to a saturation amount and, if desired, (D) a requisite amount of a curing catalyst. The composition exhibits satisfactory adhesion to a substrate in such adhesion operation as an FIPG system without requiring wiping of organic oily contaminants on the substrate, such as hydrocarbon oils, e.g., a rust preventing oil and an engine oil.
申请公布号 US5641832(A) 申请公布日期 1997.06.24
申请号 US19960585434 申请日期 1996.01.11
申请人 TOSHIBA SILICONE CO. LTD. 发明人 NAGAOKA, HISAYUKI
分类号 C08K5/54;C08K9/04;C08L83/04;C08L83/06;(IPC1-7):C08K5/16 主分类号 C08K5/54
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