| 摘要 |
The present invention refers to a method of encapsulating, an electronic component in a mold, said electronic component having a number of enlarged connection elements that laterally project in a parallel relationship between each other relative to a plane, said connection elements lacking metallic connections therethrough, and having a specific mutual slant (PL), width (WL) and height (TL), and two films inserted therein, each film comprising a predetermined thickness, (TTF or TBF, respectively); a flexible film is used, and encapsulation is carried out under such conditions that, during the process, condition: C . TL - {1 - WL/PL} <- (TTF + TBF) in the position of the fastening clamp edges of the matrix portions, is fulfilled, wherein C = 2.5. |
