| 摘要 |
This invention provides a thin gold-alloy wire for a semiconductor device capable of improving long term reliability of bonding with an electrode and capable of simultaneously accomplishing reduction of a wire bend and wire flow at the time of resin molding and high looping. The thin gold-alloy wire contains 50 to 3000 ppm by weight of Mn and the balance comprising gold and unavoidable impurities. Further, the thin gold-alloy wire comprises any of the following combinations +E,crc 1+EE , +E,crc 2+EE , +E,crc 1+EE ++E,crc 2+EE , +E,crc 2+EE ++E,crc 3+EE and +E,crc 1+EE ++E,crc 2+EE ++E,crc 3+EE when element groups to be added are classified into the following groups +E,crc 1+EE to +E,crc 3+EE : +E,crc 1+EE 1 to 20 ppm by weight in total of at least one of Be and B; +E,crc 2+EE 1 to 30 ppm by weight in total of at least one of Ca, Sr and rare earth elements; and +E,crc 3+EE 1 to 50 ppm by weight in total of at least one of In and Tl. The thin gold-alloy wire according to the present invention has high bonding reliability at the bond portion with the electrode on a semiconductor device and can be packaged with high density semiconductor devices.
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