发明名称 |
Photosensitive resin composition |
摘要 |
A photosensitive resin composition comprising, as its main ingredient, a poly(amic acid) resin constituted of a diamino compound represented by formula: <IMAGE> (I) and optionally used other diamino compound and a tetracarboxylic acid dianhydride as its constituent monomers and/or a poly(amic acid) ester resin obtained by esterifying said poly(amic acid) resin and/or a polyimide resin obtained by a dehydrating or alcohol-eliminating ring-closure reaction of said poly(amic acid) resin or poly(amic acid) ester resin has an excellent developability and a high film strength and can form a relief patter of low thermal expansion.
|
申请公布号 |
US5668248(A) |
申请公布日期 |
1997.09.16 |
申请号 |
US19950517583 |
申请日期 |
1995.08.22 |
申请人 |
HITACHI CHEMICAL CO., LTD. |
发明人 |
HAGIWARA, HIDEO;KAJI, MAKOTO;NISHIZAWA, HIROSHI;SUZUKI, KENJI;KOJIMA, YASUNORI |
分类号 |
C07C275/40;C08G73/06;C08G73/10;C08G73/16;G03F7/038;(IPC1-7):C08G73/10;C08G69/26 |
主分类号 |
C07C275/40 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|