发明名称 |
Heat sink structure with corrugated wound wire heat conductive elements |
摘要 |
A heat sink structure with a heat-conducting base and wound wire heat conductors thermally attached to the base for use in electronic packaging structures, e.g., those used in computers. The method of making such a structure, as taught herein, provides a unique structure using wire to form the thermally conductive members in a corrugated shape and aligning these with and thermally coupling to a base structure. In one embodiment, the base structure may be excluded with a heat conductive spacer member used instead.
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申请公布号 |
US5673177(A) |
申请公布日期 |
1997.09.30 |
申请号 |
US19950509915 |
申请日期 |
1995.08.01 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BRODSKY, WILLIAM LOUIS;KEHLEY, GLENN LEE;SATHE, SANJEEV BALWANT |
分类号 |
H01L23/36;H05K7/20;(IPC1-7):H05K7/20 |
主分类号 |
H01L23/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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